• Model Number: AP-G1426
• Place of Origin: Guangdong, China
• Minimum Order Quantity: 0 Pieces
• Supply Capacity: 0 Pieces/month
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Description


LED Silicone Package Material AP-G1426A/B

1, Introduction:
AP-G1426A/B is double component, adduct cured silicon material, uses for LED package and fill. After curing, it has high light transmittance, good heat-stability, small stress and low hygroscopicity etc..

2, Technical parameter:
Item Technical parameter Before Curing (A component) Appearance Colourless transparent liquid Viscosity mPa• s(25¡æ) 1300 Before Curing (B component) Appearance Colourless transparent liquid Viscosity mPa• s(25¡æ) 800 Mix ratio 1: 1 Mix-viscositymPa• s(25¡æ) 1100 Typical curing condition 25¡æ× 12h(70¡æ× 1h) Operate time(25¡æ) 90min After curing Refractive(25¡æ) 1.42 Transmittance(£¥, 450 nm) ©ƒ95 penetration(mm/10) 220¡«270

3, Usage:
A, B=1: 1, can only be used after you remove the bubble in the conditionof 10mmHg vacuum. Please operate in dry and clear.

4, Attentions:
Some of materials, chemical, curing agent, plasticizer can control the gel material’ s curing. There are are including:
1, organotin and other metallorganic compound
2, sulphur, polysulfide, polysulfone and other sulfur-containing
3, amine, polyester rubber and other ammoniac
4, phosphorig and other phosphorig-containing If any doubt that whether some kind of material would restrain the curing, we suggest a compatibility experiment test for the suitability. If the uncured packaging materials exist the surface of the curing ones, then the curing incompatible, restrain curing.