• Model Number: AP-G1418
• Place of Origin: Guangdong, China
• Minimum Order Quantity: 0 Pieces
• Supply Capacity: 0 Pieces/month
• MemberShip: Free Member
• Inquiry Now
• Bookmark & Share:

Description


LED Silicone Package Material AP-G1418A/B

1, Introduction:
AP-G1418A/B is double component, adduct cured silicon material, uses for LED package and fill. After curing, it has high light tranmittance, good heat-stability, small stress and low hygroscopicity etc.

2, Technical parameter:
Item Technical parameter Before Curing (A Component) Appearance Colourless transparent liquid Viscosity mPa•s(25¡æ) 1200 After Curing (B Component) Appearance Colourless transparent liquid Viscosity mPa•s(25¡æ) 900 Mix ratio 1: 1 Mix Viscosity mPa•s(25¡æ) 1100 Typical Curing condition 25¡æ×12h(70¡æ×1h) Operate time(25¡æ) 90min After Curing Refractive(25¡æ) 1.42 transmittance(£¥, 450 nm) ©ƒ95 penetration(mm/10) 120¡«170

3, Usage:
A, B=1: 1, can only be used after you remove the bubble in the conditionof 10mmHg vacuum.Please operate in dry and clear.

4, Attentions:
Some of materials, chemical, curing agent, plasticizer can control the gel material’s curing. There are are including:
1, organotin and other metallorganic compound
2, sulphur, polysulfide, polysulfone and other sulfur-containing
3, amine, polyester rubber and other ammoniac
4, phosphorig and other phosphorig-containing If any doubt that whether some kind of material would restrain the curing, we suggest a compatibility experiment test for the suitability. If the uncured packaging materials exist the surface of the curing ones,then the curing incompatible, restrain curing.